Playing a crucial interconnect role in integrated circuits and semiconductor testing, test sockets, aka package probes, serve the role of connecting a device and its tester. IC sockets are categorized ...

Today’s electronic packages have high clock speeds (multi-gigahertz range), fine pin densities (below 0.4-mm pitch), and high pin counts (over 2000). When assembled onto a printed-circuit board (PCB), ...

The Giga-snap SFS-BGA200B-52 socket allows an 11 x 14.5-mm, 200-ball BGA IC with a 0.65-mm pitch, 12 x 22-array to be placed in a socket with the same footprint as the IC to avoid compromising ...

Tesla has been granted a patent for a multi-chip module design featuring a Redistribution Layer substrate with IC dies mounted on both surfaces, sockets, and a cold plate. The innovative mounting ...