We'll dive into five fantastic 3D software options that will take your filmmaking game to another level with mind-blowing visuals. Get ready to sculpt, animate, and create awe-inspiring worlds with ...
The heterogeneous integration of multiple ICs in a single package along with high-performance, high-bandwidth memory is critical for many high-performance computing applications. After everything has ...
Artec 3D launches Artec Studio Lite - designed to make professional-grade 3D tools available to a wider audience.
Three independent design processes – chip, package, and PCB – are typically required for the latest electronic products which utilize increasingly complex systems on chip (SoCs) and multiple chips in ...
The semiconductor industry is turning to 3D integrated circuits (3D ICs) to meet increasing demands for high performance, miniaturization and energy efficiency. By stacking dies into 3D assemblies, we ...
The move to heterogeneous multi-chip/chiplet products improves yield, performance and modularity while reducing power and overall product footprint. However, this shift to heterogeneous assembly also ...
The American Society of Mechanical Engineers (ASME) says it recently published an updated standard based largely on research by the National Institute of Standards and Technology (NIST), and it ...
How to insert and manipulate 3D models in Microsoft Word Your email has been sent Microsoft 365 applications can fake 3D shapes and letters, but the effect is often less than satisfying. If you must ...
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