Researchers at ETH Zürich, CISPA, and New York University published a technical paper titled “Terracotta: Enabling the ...

Increasing power density makes heat, stress, and aging harder to predict, and more critical to address earlier in the design flow.

CFETs and buried power rails; agentic AI for EDA; 6G architecture decisions; chiplet connectivity.

Researchers at Georgia Institute of Technology published a technical paper titled “Low-loss ultra-compact photonic bends with enhanced fabrication tolerance for commercial foundry processes.” Abstract ...

Researchers at Seoul National University and Yonsei University published a technical paper titled “Monolithic three-dimensionally integrated memristor-thin-film transistor for electrically ...

Researchers at the University of California, Santa Cruz published a technical paper titled “Design Space Exploration of Backside Clock Meshes for 2 nm GAAFET BSPDN Technology.” Abstract Excerpt: ...

Geert Hellings is program director for XTCO/compute density at imec. Hellings received the Ph.D. degree Electrical Engineering from the KU Leuven, Belgium, in 2012.

Researchers at Huazhong University of Science and Technology, Hong Kong Polytechnic University, University of California, Santa Barbara, and National University of Singapore published a technical ...

Researchers at the UC Berkeley and FuriosaAI published a technical paper titled “Characterizing High Bandwidth Flash for LLM ...

Researchers at Georgia Institute of Technology, Qatar Computing Research Institute, and Purdue University published a ...

Distributed NVM supports high-endurance telemetry logging, functional safety, and time-sensitive networking where resilience ...

Orbital data centers, defense systems, quantum computing, particle physics, and advanced manufacturing are raising the bar ...