Business Wire

Samsung Electronics To Provide Turnkey Semiconductor Solutions With 2nm GAA process and 2.5D Package to Preferred Networks

SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced that it will provide turnkey semiconductor solutions using the ...
Semiconductor Engineering

2.5D Leverages Existing Tools On The Way To 3D

As design and manufacturing issues with true 3D design continue to be worked out, interim 2.5D technologies are moving ahead as engineering teams leverage this packaging-driven approach to manage heat ...
Semiconductor Engineering

2.5D Adds Test Challenges

OSATs and ATE vendors are making progress in determining what works and what doesn’t in 2.5D packaging, expanding their knowledge base as this evolves into a mainstream technology. Most experts ...
Business Wire

Cadence Tapes Out 16G UCIe Advanced Package IP on TSMC’s N3E Process Technology

SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the tapeout of Cadence ® 16G UCIe™ 2.5D advanced package IP on TSMC’s 3nm (N3E) process technology.
AZOM

IDTechEx Explores Advanced Semiconductor Packaging Technologies: 2.5D and 3D Insights

2.5D and 3D Packaging Technology: The 2.5D and 3D packaging technologies encompass various packaging techniques. In 2.5D packaging, the choice of interposer material categorizes it into Si-based, ...