In recent years there has been a sharp rise of multi-die system designs. Numerous publications targeting a large variety of applications exist in the public domain. One presentation [2] on the IEEE’s ...
High-bandwidth memory (HBM) sales are spiking as the amount of data that needs to be processed quickly by state-of-the-art AI ...
Panel-level packaging offers scalability and cost efficiency, but meeting advanced node process targets remains a formidable ...
A discussion with Jay Vleeschhouwer of Griffin Securities on EDA's continued consolidation, expansion into engineering ...
Factors that impact mask lifetime, the future role of actinic inspection, and minimum mask dimensions for high-NA EUV.
Device design begins with the anticipated workload. What is it actually supposed to do? What resources — computational units, ...
A new IEEE technical paper titled “Package Assembly Design Kits (PADK’s)- The Future of Advanced Wafer-Level Manufacturing” ...
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