A knob can make a surprisingly versatile interface, particularly if it’s the SmartKnob, which builds a knob around a BLDC ...
Abstract: Solder joint fatigue is a major cause to failure of electronic packages under board level temperature cycling test (TCT). In order to enhance solder joint board level reliability, the trend ...
Abstract: Optical transceivers form the backbone of our ICT infrastructure and are required to transport ever-growing capacities in ever-shrinking energy and density footprints. In this tutorial, CMOS ...
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