Because in the age of AI, performance is no longer determined by a single chip itself. It is shaped by how efficiently the ...

Test vendors are adapting to changing connector architectures and extreme alignment tolerances as co-packaged optics heads ...

The shift from software-defined to AI-defined vehicles raises questions about whether the hardware can keep up.

An integrated methodology for accelerating process development and sustaining production control for advanced packaging ...

As models evolve faster than silicon cycles, chip architects must balance flexible compute, data movement, and ...

How complementary inspection and metrology techniques can detect smaller defects and distinguish among a wide range of defect types within a unified workflow.

Researchers at Carl Zeiss SMT and ASML published a technical paper titled “Hyper-NA: a system with a numerical aperture of at least 0.75.” Abstract Summary: The researchers examine Hyper-NA EUV ...

Ben Mitchel is senior director of product marketing and business development at teradyne, where he leads market strategy and ...

Increasing power density makes heat, stress, and aging harder to predict, and more critical to address earlier in the design flow.

Researchers at ETH Zürich, CISPA, and New York University published a technical paper titled “Terracotta: Enabling the ...

Low-contact-resistance WSe₂ transistors; backside clock meshes for 2nm GAAFETs; row-parallel processing in DRAM; HBF for high-throughput LLM serving; formal security analysis of CAN XL; abstraction ...

Artificial intelligence, high-performance computing systems, advanced smartphones, automotive electronics, and ...